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PEER REVIEWED PAPERS

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161
Byung-Dae Park, Bernard Riedl, Ernest W. Hsu and Jack A. Shields. Effects of Molecular Weight of Phenol-Formaldehyde Adhesives on Medium Density Fiberboard Performance. Holz als Roh- und Werkstoff. 1998. 56(3): 155 - 161.
160
Byung-Dae Park, Bernard Riedl, Ernest W. Hsu, Jack A. Shields. Differential Scanning Calorimetry of Phenol-Formaldehyde Resins Cure-Accelerated by Carbonates. Polymer. 1999. 40(7): 1689 - 1699.
159
Woo-Yang Chung, Seung-GonWi, Hyeun-Jong Bae, Byung-Dae Park. Microscopic observation of wood-based composites exposed to fungal deterioration. J. Wood Sci. 1999. 45(1): 64-68.
158
Byung-Dae Park, Bernard Riedl, Ernest W. Hsu, Jack A. Shields. Hot-pressing Process Optimization by Response Surface Methodology. Forest Products J. 1999. 49(5): 62-68.
157
Byung-Dae Park, Bernard Riedl, Heyun-Jong Bae, Yoon Soo Kim. Differential Scanning Calorimetry of Phenol-Formaldehyde Adhesives. J. Wood Chem. & Tech. 1999. 19(3): 265-286.
156
Byung-Dae Park, Bernard Riedl. 13C-NMR Study on cure-accelerated phenol-formaldehyde resins with carbonates. J. Appl. Polym. Sci.. 2000. 77 (4): 841-851.
155
Byung-Dae Park, Bernard Riedl, Ernest W. Hsu, Jack A. Shields. Application of Cure-Accelerated PF Adhesives for Three-Layer Medium Density Fiberboard (MDF) Manufacture. Wood Sci. Tech. 2001. 35 (4): 311-323.
154
Byung-Dae Park, Bernard Riedl. Yoon Soo Kim, Won Tek So. Effect of Synthesis Parameters on Thermal Behavior of Phenol-Formaldehyde (PF) Resol Resin. J. Appl. Polym. Sci., 2002, 83(7): 1415-1424.
153
A. P. Singh, Y. S. Kim, Byung-Dae Park, G. C. Chung. Presence of distinct S3 layer in mild compression woodtracheids of Pinusradiata.. Holzforschung, 2003, 57(3): 243~247.
152
W. Kang, Byung-Dae Park, W. Y. Chung, H. S. Jung. Analytical modeling of rheological postbuckling behavior of wood-based composite panels under cyclic hygro-loading. Wood and Fiber Science, 2003. 35(3): 409-420.
151
A. P. Singh, Y. S. Kim, G. C. Chung, Byung-Dae Park, A. H. H. Wong. TEM Examination of surface characteristics of rubberwood (Heveabrasiliensis) HTMP fibers. Holzforschung, 2003, 57: 579-584.
150
Byung-Dae Park, Yoon Soo Kim, Adya P. Singh, KiePyo Lim. Reactivity, Chemical Structure, and Molecular Mobility of Urea-Formaldehyde (UF) Adhesives Synthesized under Different Conditions Using FT-IR and Solid State 13C CP/MAS NMR Spectroscopy.. J. Appl. Polym. Sci., 2003, 88(11): 2677-2687.
149
Byung-Dae Park,SeungGon Wi, Kwang Ho Lee, Adya P. Singh, Tae-Ho Yoon, Yoon Soo Kim. Characterization of anatomical features and silica distribution in rice husk using microscopic and micro-analytical techniques. Biomass and Bioenergy, 2003. 25(3): 319-327.
148
Byung-Dae Park, Seung Gon Wi, Kwang Ho Lee, Adya P. Singh, Tae-Ho Yoon, Yoon Soo Kim. X-ray photoelectron spectroscopy of rice husk surface modified with maleated polypropylene and silane. Biomass and Bioenergy. 2004, 27(4): 353~363.
147
Byung-Dae Park*, X. -M. Wang. Thermokinetic behavior of powdered phenol-formaldehyde (PPF) resins. Thermochimica Acta, 2005, 433(1&2): 88~ 92
146
Dong-heub Lee, Myung Jae Lee, Dong-Won Son, Byung-Dae Park*, Adhesive performance of woods treated with alternative preservatives. Wood Sci. Tech. 2006, 40(3): 228~236.
145
23. Byung-Dae Park*, Eun-Chang Kang, Jong Young Park. Differential scanning calorimetry of urea-formaldehyde adhesive resins, synthesized under different pH conditions. J. Appl. Polym. Sci., 2006, 100(1): 422-427.
144
Byung-Dae Park*, Eun-Chang Kang, Jong Young Park, Effects of Formaldehyde to Urea Mole Ratio on Thermal Curing Behavior of Urea-Formaldehyde Resin and Properties of Particleboard, J. Appl. Polym. Sci. 2006, 101(3): 1787~1792
143
Eun-Chang Kang, Sang-Bum Park, Xiuhi-Susan Sun, Byung-Dae Park, Heon Park, Curing behavior of urea-formaldehyde resin modified with cooking waste oil-based pMDI prepolymer and its influence on particleboard properties. Forest Products J. 2007, 57(6): 51-58
142
Byung-Dae Park*, Jae-Woo Kim, Dynamic mechanical analysis of urea-formaldehyde resin adhesives with different formaldehyde to urea mole ratios, J. Appl. Polym. Sci. 2008, 108(3): 2045-2051.