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6 |
Dong-heub Lee, Myung Jae Lee, Dong-Won Son, Byung-Dae Park*, Adhesive performance of woods treated with alternative preservatives. Wood Sci. Tech. 2006, 40(3): 228~236.
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5 |
23. Byung-Dae Park*, Eun-Chang Kang, Jong Young Park. Differential scanning calorimetry of urea-formaldehyde adhesive resins, synthesized under different pH conditions. J. Appl. Polym. Sci., 2006, 100(1): 422-427.
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4 |
Byung-Dae Park*, Eun-Chang Kang, Jong Young Park, Effects of Formaldehyde to Urea Mole Ratio on Thermal Curing Behavior of Urea-Formaldehyde Resin and Properties of Particleboard, J. Appl. Polym. Sci. 2006, 101(3): 1787~1792
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3 |
Lee, D.-H., Lee, M.J., Son, D.-W., Park, B.-D.
Adhesive performance of woods treated with alternative preservatives
(2006) Wood Science and Technology, 40 (3), pp. 228-236.
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2 |
Park, B.-D., Kang, E.-C., Park, J.Y.
Differential scanning calorimetry of urea-formaldehyde adhesive resins, synthesized under different pH conditions
(2006) Journal of Applied Polymer Science, 100 (1), pp. 422-427.
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1 |
Park, B.-D., Kang, E.C., Park, J.Y.
Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea-formaldehyde resin and properties of particleboard
(2006) Journal of Applied Polymer Science, 101 (3), pp. 1787-1792.
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