Park, B.-D., Riedl, B., Hsu, E.W., Shields, J. Application of cure-accelerated phenol-formaldehyde (PF) adhesives for three-layer medium density fiberboard (MDF) manufacture (2001) Wood Science and Technology, 35 (4), pp. 311-323.

Park, B.-D., Yoon Soo Kim, Won Tek So, Kie Pyo Lim. Effects of reaction pH and hardener types on reactivity, properties, and performance of urea-formaldehyde (UF) resin (2002) J. Korean Wood Sci. & Tech. 30(3) pp. 1-11.

Adya P. Singh, Park, B.-D., Seung Gon Wi, Kwang Ho Lee, Tae-Ho Yoon, Yoon Soo Kim. Light and electron microscopic characterization of husk from Korean rice. (2002) Plant Resources: 5(2) pp. 95-103.

Park, B.-D., Riedl, B., Yoon Soo Kim, So, W.T. Effect of synthesis parameters on thermal behavior of phenol-formaldehyde resol resin (2002) Journal of Applied Polymer Science, 83 (7), pp. 1415-1424.

Won Tek So, Park, B.-D.. Mechanical properties of bamboo-reinforced boards manufactured with Phyllostachysbambusoids Growing in Damyang District (1). (2003) J. Kor. For. Energy. 22(2) pp. 26~35.

Park, B.-D., Kim, Y.S., Singh, A.P., Lim, K.P. Reactivity, chemical structure, and molecular mobility of urea-formaldehyde adhesives synthesized under different conditions using FTIR and solid-state 13C CP/MAS NMR spectroscopy (2003) Journal of Applied Polymer Science, 88 (11), pp. 2677-2687.

Singh, A.P., Kim, Y.S., Park, B.D., Chung, G.C., Wong, A.H.H. Presence of a distinct S3 layer in mild compression wood tracheids of Pinus radiata (2003) Holzforschung, 57 (3), pp. 243-247.

Kang, W., Park, B.-D., Chung, W.Y., Jung, H.S. Analytical modeling of rheological postbuckling behavior of wood-based composite panels under cyclic hygro-loading (2003) Wood and Fiber Science, 35 (3), pp. 409-420.

Park, B.-D., Gon Wi, S., Ho Lee, K., Singh, A.P., Yoon, T.-H., Soo Kim, Y. Characterization of anatomical features and silica distribution in rice husk using microscopic and micro-analytical techniques (2003) Biomass and Bioenergy, 25 (3), pp. 319-327.

Singh, A.P., Kim, Y.S., Chung, G.C., Park, B.D., Wong, A.H.H. TEM Examination of Surface Characteristics of Rubberwood (Hevea brasiliensis) HTMP Fibers (2003) Holzforschung, 57 (6), pp. 579-584.

Seung Gon Wi, Kwang Ho Lee, Park, B.-D., Young Goo Park, Yoon Soo Kim, Anatomical, and topochemical characteristics of transgenic poplar down-regulated with O-methyltransferase, (2004) J. Korean Wood Sci. & Tech., 32(3) pp. 15-24.

Park, B.-D., Wi, S.G., Lee, K.H., Singh, A.P., Yoon, T.-H., Kim, Y.S. X-ray photoelectron spectroscopy of rice husk surface modified with maleated polypropylene and silane (2004) Biomass and Bioenergy, 27 (4), pp. 353-363.

Park, B.-D., Wang, X.-M. Thermokinetic behavior of powdered phenol-formaldehyde (PPF) resins (2005) Thermochimica Acta, 433 (1-2), pp. 88-92.

Lee, D.-H., Lee, M.J., Son, D.-W., Park, B.-D. Adhesive performance of woods treated with alternative preservatives (2006) Wood Science and Technology, 40 (3), pp. 228-236.

Park, B.-D., Kang, E.-C., Park, J.Y. Differential scanning calorimetry of urea-formaldehyde adhesive resins, synthesized under different pH conditions (2006) Journal of Applied Polymer Science, 100 (1), pp. 422-427.

Park, B.-D., Kang, E.C., Park, J.Y. Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea-formaldehyde resin and properties of particleboard (2006) Journal of Applied Polymer Science, 101 (3), pp. 1787-1792.

Kang, E.-C., Park, S.-B., Sun, X.S., Park, B.-D., Park, H. Curing behavior of urea-formaldehyde resin modified with cooking waste oil-based pMDI prepolymer and its influence on particleboard properties (2007) Forest Products Journal, 57 (6), pp. 51-58.

Park, B.-D., Kim, J.-W. Dynamic mechanical analysis of urea-formaldehyde resin adhesives with different formaldehyde-to-urea molar ratios (2008) Journal of Applied Polymer Science, 108 (3), pp. 2045-2051.

Lee, S.-Y., Kang, I.-A., Doh, G.-H., Yoon, H.-G., Park, B.-D., Wu, Q. Thermal and mechanical properties of wood flour/talc-filled polylactic acid composites: Effect of filler content and coupling treatment (2008) Journal of Thermoplastic Composite Materials, 21 (3), pp. 209-223.

Park, B.D., Kang, E.-C., Park, J.-Y. Thermal curing behavior of modified urea-formaldehyde resin adhesives with two formaldehyde scavengers and their influence on adhesion performance (2008) Journal of Applied Polymer Science, 110 (3), pp. 1573-1580.